Gadget Hero’s Mechanic UV559 No Clean Welding Flux BGA Solder Ball Repair Solder Auxiliary Soldering Paste For Phone PCB PGA SMD Rework
Price: ₹1,791.00
(as of Jun 03, 2026 21:08:09 UTC – Details)
MECHANIC FLUX PASTE 559 10CC Product Features Professional advanced OEM RMA-223/559 BGA soldering paste flux+squeeze tube +free needle tip. 100% new brand and high quality. Good immersion and high intensity joint. Easy to peel off with hands or tweezers, leave no residue. Won’t oxidating gold, copper, phosphorus, bronze, oxidation. Prevent contamination during assembly. RMA-223/559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips. RMA-223/559 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. High soaking ，high strength joints. No-toxic, no-corrosive, strong ability of insulation. Good insulation and smooth welding surface. No deterioration no dry. No poison no orrosion, no damage to parts. Product Specifications Flux Type: RMA-559 Volume: 10ml/10cc Dimension: 93 x 33 x 23mm Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. Color: Yellow Insulated: Yes With Needle Tip: Yes Application: for soldering and reballing of computer and phone chips. Advantage: Good immersion and high intensity joint. Function: for PCB , BGA , PGA reworkin. 100%: New Type, high quality.
PROFESSIONAL GRADE: UV-559 no-clean soldering flux paste designed specifically for electronics and BGA repair applications
CONVENIENT PACKAGING: Supplied in a precise 10mL syringe for controlled and accurate dispensing during soldering tasks
COMPOSITION: Halogen-free formulation ensures safe use on sensitive electronic components and circuit boards
APPLICATION: Ideal for surface mount technology (SMT), through-hole soldering, and ball grid array (BGA) rework
RESIDUE CHARACTERISTICS: No-clean formula eliminates the need for post-soldering cleaning, saving time and effort
Professional advanced RMA-UV559 BGA soldering paste flux+squeeze tube +free needle tip. Good immersion and high intensity joint. Easy to peel off with hands or tweezers, leave no residue. Won’t oxidate gold, copper, phosphorus, bronze, oxidation. Prevent contamination during assembly. RMA-223/559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips.
RMA-559 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. High soaking, high strength joints. No-toxic, no-corrosive, strong ability of insulation. Good insulation and smooth welding surface. No deterioration no dry. No poison no orrosion, no damage to parts.
Product Specifications Flux Type: RMA-559 Volume: 10ml/10cc Dimension: 93 x 33 x 23mm Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. Color: Yellow Insulated: Yes With Needle Tip: Yes Application: for soldering and reballing of computer and phone chips. Advantage: Good immersion and high intensity joint. Function: for PCB , BGA , PGA reworking.
